Lapping and Polishing Machines and Fixtures

This light weight, bench top Grinding/Polishing model is ideal for surface preparation of small metallographic specimens. It is adjustable in speed from 0 to 1725 RPM, and has ⅓ HP and it is fully grounded. The coolant is applied to the wheel through an adjustable flow control goose-neck spout. The unit comes complete with a compression fitting for an easy connection into the existing coolant supply. Measures: 13" x 15.25" x 9.5" (H); Weight 35 lb. 110 volt, 60HzGet more news about Polishing Fixture,you can vist our website!

ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance's unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC's.

Along with its signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.

Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.

The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power Polish' mode is incorporated that rotates the sample during processing.Our patented ULTRACOLLIMATOR technology allows for fast accurate and repeatable parallel alignment of surfaces to the polisher. Since the collimator beam optically aligns directly to the die, there is no guesswork or the need to use mechanical indicators. Alignment is constantly monitored during polishing. Transfer to-and-from the microscope is made fast and accurate. Any small realignments can be made quickly and accurately.

ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a 'single box' solution, incorporating an lcd screen and all the controls required to align the sample.

The use of optical alignment allows for simpler faster and significantly more accurate alignment to be achieved on a range of sample types and applications including: Crystal polishing, Double side wafer polishing, Topside de-processing of layers of metal circuitry for electronic failure analysis and competitive analyses, Backside polishing of packaged computer dice for 'through silicon' microscopy.

ULTRAPOL Advance Polishing System includes: Base unit with timer, oscillator, speed control (50 to 400rpm), 8" (200mm) Polishing plate Sample Z-direction control with 1µm precision Mechanical alignment indicator 2 circle tilt control (+/- 2 degrees) Sample Rotation control Quick release interface mounting system 2 sample mounting plates and start-up accessory kit Sample Load Control - 0 to 3 kg (in 50 gram increments) Drip Tray / Slurry Containment Tray.